I-BPA(10)EODMA CAS 41637-38-1

I-CAS:41637-38-1

I-Molecular Formula:(C2H4O)n(C2H4O)nC23H24O4

Isisindo se-Molecular:452

I-EINECS:609-946-4

Isikhathi Sokugcina:1 unyaka

Igama elifanayo:I-DPD1; TGFB; I-Diaphyseal dysplasia 1; Okuqhubekayo; I-Diethyl carbote

Shiya Umlayezo Wakho

Imininingwane Yomkhiqizo

Landa

Omaka bomkhiqizo

Iyini i-BPA(10)EODMA CAS 41637-38-1?

I-Diethyl carbonate iwuketshezi olungenambala futhi olusobala olunephunga elimnandi kancane. Ayincibiliki emanzini, incibilika kuzincibilikisi eziphilayo njengotshwala ne-ether.

Ukucaciswa

ITEM	IZINGA
Ukubukeka	Icacile futhi isobala
I-Viscosity	350 ~ 450 cP
Inani le-Acid	≤0.50 mg KOH/g
Umbala	≤100 APHA
Amandla adonsela phansi athize	1.110 ~ 1.130

Isicelo

(1) Izinto ezilashwe yi-UV (Ukwelashwa kwe-UV
Izingubo zokugqoka noyinki
Njenge-diluent esebenzayo, isetshenziswa emigqonyeni ekwazi ukuphulukiswa yi-UV (njengamapulangwe kanye nama-metal coatings) ukuthuthukisa ubulukhuni nokumelana namakhemikhali.
Yehlisa ingcindezi yokuncipha koyinki wokuphrinta ukuze uvimbele ukuwohloka kwe-substrate.

I-resin yokuphrinta ye-3D
Ukusebenza kabusha okuphezulu kanye ne-viscosity ephansi kuyenza ifanelekele ukuphrinta kwe-3D elapha ukukhanya (njengamamodeli wamazinyo nezingxenye ezinembayo).

(2) Izinto zamazinyo
I-resin ehlanganisiwe
Uma ihlanganiswe nezigcwalisi zengilazi (njenge-SiO₂), isetshenziswa ezintweni zokubuyisela amazinyo (ukugcwaliswa, ama-veneers), afaka kokubili amandla kanye nobuhle.

Okunamathelayo:
Njengengxenye yezinto ezinamathelayo zamazinyo, yelapheka ngokushesha futhi inokuvumelana okuhle kwe-biocompatibility.

(3) Ukupakishwa nge-elekthronikhi
Izinto zokuvikela
I-encapsulation adhesive ye-PCB (ephrintiwe Circuit board), ukumelana nokushisa kanye nomswakama.

I-Photoresist
Njengengxenye ye-photosensitive resin, isetshenziswa enqubweni yokuqhafaza yokwenziwa kwe-semiconductor.

(4) Ingcina
I-adhesive yesakhiwo
Uma ihlanganiswe ne-epoxy resin, ithuthukisa ukuqina nokunamathela (njengokubopha kwezimoto kanye ne-aerospace).